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nexthop ai

Thermal Engineer

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Job Description

Company Overview:

We are a high-growth startup building next-generation high‑performance switching systems for hyperscale and AI data centers. Our platforms power large-scale cloud infrastructure, GPU clusters, and high-density compute environments where performance, reliability, and thermal efficiency are critical to customer operations.

Position Summary:

The Liquid Cooling Process Engineer owns the manufacturing process definition, validation, and scaling of liquid-cooled network products in conjunction with NH engineering. This role bridges thermal design, mechanical design, manufacturing engineering, reliability, and supply chain to ensure liquid-cooling solutions—cold plates, manifolds, hoses, quick-disconnects, and TIMs—are repeatable, leak-free, thermally efficient, and production-scalable.

The role is critical to enabling >50–100 kW per rack architectures, supporting next-generation AI fabrics and ultra-high-bandwidth network switches without compromising reliability or serviceability.

Key Responsibilities:

Process Definition & Development

  • Define end-to-end manufacturing processes in close collaboration with engineering for:
  • Direct-to-chip cold plates
  • Manifolds and distribution plates
  • Tubing, hoses, and quick-disconnects (QDs)
  • TIM application (grease, PCM, gap fillers)
  • Develop process flow diagrams, control plans, and work instructions
  • Ensure processes are DFM/DFA/DFS compliant and serviceable in field environments

NPI Execution (EVT → DVT → PVT → MP)

  • Enable fast prototyping and rapid iterative development cycles
  • Drive development of DFMEA (Design Failure Mode Effects and Analysis) with engineering
  • Support thermal hardware from early EVT through HVM ramp
  • Identify and mitigate process risks:
  • Leak paths
  • Torque variation
  • Flatness and coplanarity
  • Particulate contamination
  • Lead process validation builds and golden line definition
  • Partner with ODMs to ensure manufacturability at scale

Assembly, Tooling & Automation

  • Specify and qualify:
  • Torque tools and sequencing strategies
  • Dispensing systems for TIMs and sealants
  • Pressure and leak-test equipment (air, helium, liquid)
  • Drive semi-automated and automated solutions for:
  • Cold-plate installation
  • Hose routing and retention
  • QD (Quick Disconnect) engagement verification
  • Define poka-yoke mechanisms to prevent mis-builds

Quality, Reliability & Validation

  • Own PFMEA (Process Failure Mode Effects and Analysis) and control plans for liquid-cooling processes
  • Define acceptance criteria for:
  • Leak rate
  • Pressure decay
  • Flow resistance
  • Thermal performance
  • Support HALT/HASS, thermal cycling, vibration, and shock testing
  • Lead root-cause analysis for field and factory issues (leaks, clogging, corrosion)

Data, Monitoring & Continuous Improvement

  • Establish process KPIs:
  • Leak ppm
  • Torque Cp/Cpk
  • TIM thickness uniformity
  • Yield and rework rates
  • Integrate test data into MES and quality dashboards
  • Drive yield improvement and cost reduction through data-driven analysis

Supplier & Partner Management

  • Work closely with:
  • Cold-plate suppliers
  • Hose and QD vendors
  • TIM and sealant suppliers
  • ODM/OEM manufacturing teams
  • Qualify suppliers and define incoming quality requirements
  • Support dual-sourcing and cost-down initiatives

Required Qualifications:

  • Master's degree in Mechanical Engineering, Manufacturing Engineering, or related field
  • 7+ years experience in manufacturing and process engineering with 2+ years of liquid cooling experience
  • Hands-on experience with thermal or fluid-handling hardware
  • Strong understanding of:
  • Mechanical tolerances and torque control
  • Assembly processes and tooling
  • Manufacturing quality systems
  • Thermodynamics
  • Heat transfer
  • Experience with liquid-cooled servers, network switches, or HPC systems
  • Experience working in or with startups

Preferred Qualifications:

  • Familiarity with:
  • Cold-plate design and materials (Cu, Al, Ni plating)
  • TIM characterization and dispensing
  • Leak detection methods (helium mass spec, pressure decay)
  • Experience working with hyperscalers or large ODMs
  • Knowledge of data-center cooling architectures (DLC, CDU, facility interfaces)

Key Competencies:

  • Strong hands-on manufacturing mindset
  • Ability to translate thermal design into robust production processes
  • Structured problem-solving and root-cause analysis
  • Cross-functional communication and influence
  • Comfortable operating in fast-paced NPI and ramp environments

Success Metrics:

  • Leak rate at factory and in field
  • Thermal performance consistency
  • First-pass yield through PVT and MP
  • NPI schedule adherence
  • Cost and cycle-time targets achieved
  • Use of automation to reduce variability and increase throughput + yield

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About Company

Job ID: 146594653

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