Nexthop AI is building the next-generation AI networking platforms for hyperscalers. We're looking for an SMT BGA Domain Expert with large BGA experience to guide the SMT Manufacturing and Quality process for large BGAs.
Description:
You will be the person guiding and optimizing the build process for our products from PCB design through box builds for BGA processing. Your expertise in BGA SMT technology and your ability to swiftly resolve issue through xVT in SMT and FATP will enable scaling. Your focus on quality from concept to product and production will enable us to maintain our high standards. This critical role will interact with Engineering, PM, CM and Procurement to achieve their goals.
Responsibilities:
- Design and optimize BGA SMT processes.
- Ensure the correct placement and soldering of BGAs to reduce defects to 150ppm
- Conduct inspections and testing to ensure functionality and quality.
- Provide guidance to cross functional teams to ensure Design for Excellence and Quality principles are integrated into all stages of the design and development process.
- Drive continuous improvement in SMT BGA DFx methodologies, ensuring the latest best practices, tools and technologies are leveraged.
- Establish PCBAs processing and assembly specifications for manufacturing and scaling for BGAs.
- Work with main stake holders in the completion of DFx (DFM, DFT, DFA and DFS) optimizing designs for volume manufacturing of PCBAs for BGAs
- Proactively Identify high risk areas in production and engineering design cycle.
- Review BOMs, PCB panels, PCB stack up, with internal stake holders and contract manufacturers.
- Identify, root cause and track issues. With CMs/Vendors/Design Engineers on necessary changes through the production launch process.
- Work with BGA vendors to partner with Nexthop and focus on DFx.
- Manage ECOs to consolidate them and be the interface for change with the CMs.
- Define quality metrics for the product and refine it as the product matures. Implement this with the CMs
Qualifications:
- 7+ years experience on PCBA Large BGA Manufacturing Process
- 7+ years experience in electronics manufacturing focused in solving challenging issues through methodical problem solving techniques.
- At least 2+ years working for a startup preferred
- Strong knowledge of PCBA materials properties and solder joint metallurgy.
- Experience with CAD tools, PCBA/FPC layout review and design optimization.
- Ability to lead and sustain supplier manufacturing test process to the higher standards.
- Ability to travel as needed to CM locations.
- Ability to work and communicate with cross functional teams.
- Ability to manage ambiguity and create clarity, oversee multiple projects and make them better.
- Experience working at CM (Contract Manufacturer) for high production rate of PCBAs and box builds
