JOB PURPOSE
The Lead Process Engineer (Front End) is responsible for driving technical excellence and continuous improvement across key frontend processes for longwavelength optical modules. The role focuses on solving complex massproduction problems, introducing automated equipment, optimizing process consistency, and ensuring new products are successfully transferred from R&D to manufacturing.
KEY RESPONSIBILITY
Front-End Process Engineering
- Lead the technical improvement of key frontend processes for longwavelength optical modules.
- Define, optimize, and validate process parameters to enhance production efficiency and product consistency.
- Conduct systematic analysis on process bottlenecks, variation sources, and equipment capability.
Troubleshooting & Production Support
- Identify, investigate, and resolve complex process abnormalities in mass production.
- Conduct rootcause analysis using DOE, FMEA, 5Why, fishbone, and other engineering methodologies.
- Collaborate with crossfunctional teams to implement corrective and preventive actions.
Equipment & Automation Ownership
- Promote the introduction of automated equipment into the frontend process.
- Operate, program, and optimize die bonding and wire bonding equipment, particularly: ASM, Datacom, MRSI, ICube
- Improve equipment uptime, accuracy, cycle time, and bonding quality through structured process-engineering methods.
NPI & Technology Transfer
- Support the introduction of new products by coordinating with R&D and global engineering teams.
- Lead trial runs, qualification builds, and rampup activities.
- Establish and update process specifications, WI, SOPs, control plans, and PFMEA.
Data Analysis & Continuous Improvement
- Drive yield improvement initiatives through data analysis and structured experimentation.
- Build and maintain process capability metrics (e.g., Cp/Cpk, UPH, FPY).
- Recommend improvements to enhance cost, efficiency, reliability, and process standardization.
Cross-Site & Cross-Functional Collaboration
- Cooperate closely with global teams across multiple time zones.
- Provide technical reports, build presentations, and lead engineering discussions with internal/external stakeholders.
- Support flexible work schedules aligned with multinational collaboration requirements.
REQUIREMENTS
- Bachelor's degree or above, major in Electronic package, Mechanical, Optoelectronic, material or other related
- 7+ years of experience in optical transceiver or semiconductor package industry
- International training: 6 months in China, followed by a mandatory bonding agreement
- Good command of English (4 skills)
- Experience in die bonding/wire bonding is preferred
- Hands-on experience in the relevant manufacturing environment is necessary
- Able to investigate and troubleshoot process abnormalities
- Skilled in the die bonding/wire bonding, have experience work on the ASM/Datacom/MRSI/I-Cube and wire-bond platform and program
- Deep understanding of optical transceiver or semiconductor process and related rig theory
- Strong problem-solving capabilities and analysis skills
- Proficient with Microsoft Office Software
Working location: Nhon Trach 2, Dong Nai (shuttle bus provided)
Working time: Standard 40-hour workweek with flexible arrangements to support work-life balance and productivity
