Experienced PCB Design Engineer

• Extract S-parameters (Touchstone format) and RLC ladder models from design data using electromagnetic analysis tools (Ansys HFSS and SIwave)
• Perform simulations with a sim tool (Synopsys HSPICE)
• Design board (.brd) and package (.mcm) data using a design tool (Cadense Allegro)- Create schematics using Cadense OrCAD (optional)

Qualification:

• Hands-on expertise with Ansys HFSS, Ansys SIwave, and Synopsys HSPICE
• Strong understanding of: Signal Integrity (SI); and Power Integrity (PI)
• High-speed interconnect modeling
• Ability to interpret design data and convert it into meaningful electrical models
• Experience with Cadence Allegro for board and package design
• Familiarity with .brd and .mcm file formats
• Experience with Cadence OrCAD schematic capture
• Strong problem solving mindset and ability to work in fast-paced environment.
• Good communication skills, ability to cooperate with other teams.
• Ability to communicate in Japanese is a plus.