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YOUR ROLE

Senior PVD Process Engineer responsible for developing, qualifying, optimizing, and sustaining tungsten deposition and etch back processes on Applied Materials (AMAT) Centura platforms. The role focuses on ensuring process stability, yield improvement, equipment matching, defect reduction, and robust production support in a semiconductor manufacturing environment.

Key Responsibilities:

Develop and optimize tungsten PVD deposition and etch back processes on AMAT Centura tools.
Perform process setup, characterization, and DOE-driven optimization for film properties, uniformity, and step coverage.
Monitor and improve key metrics such as Film thickness, Within-wafer non-uniformity, Defectivity, Yield, Tool matching and repeatability
Support tool qualification, process qualification, and product transfers.
Troubleshoot process excursions, tool events, particle issues, and compatibility concerns.
Collaborate with equipment, integration, yield, and manufacturing teams to resolve issues quickly.
Analyze metrology and inline data to identify root causes and implement corrective actions.
Maintain process documentation, control plans, and standard operating procedures.
Support preventive maintenance, chamber matching, and process stability initiatives.
Drive continuous improvement activities to reduce cycle time, cost, and scrap.

YOUR SKILLS & EXPERIENCES

Bachelor's degree in engineering discipline or similar
Min 3 years of process experience in Thin Film
Knowledge of Tungsten deposition or etch back process
Experience with AMAT Centura Tool type.
Additional experiences with Novellus Altus tool type will be a plus point.

Senior Process Engineer, PVD