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Skills:
Statistical Analysis, advanced process control methodologies, immersion lithography, OPC development, photolithography processes, material characterization, Optics, polarized illumination, lithography simulation tools, reticle layout, low k1 imaging, Doe, process window analysis, overlay optimization, Simulation Software
Skills:
wafer bonding , assembly processes , Reports, Process Development, Research And Development, design of experiments, wire bonding, product manufacturability, Proof Of Concept, characterization, Metrology, Liaising with cross functional teams
